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Browsing by Author Yao, DJ
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Showing results 1 to 4 of 4
Issue Date
Title
Author(s)
1-Aug-2005
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
Hsu, YC
;
Chou, CK
;
Liu, PC
;
Chen, C
;
Yao, DJ
;
Chou, T
;
Tu, KN
;
材料科學與工程學系
;
Department of Materials Science and Engineering
9-Jan-2006
Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
Chiu, SH
;
Shao, TL
;
Chen, C
;
Yao, DJ
;
Hsu, CY
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-May-2006
Temperature and current-density distributions in flip-chip solder joints with Cu traces
Hsu, CY
;
Yao, DJ
;
Liang, SW
;
Chen, C
;
Yeh, ECC
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-Nov-2004
Thermal gradient in solder joints under electrical-current stressing
Shao, TL
;
Chiu, SH
;
Chen, C
;
Yao, DJ
;
Hsu, CY
;
材料科學與工程學系
;
Department of Materials Science and Engineering