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dc.contributor.authorMENG Hsin-Feien_US
dc.contributor.authorLin Hao-Wuen_US
dc.contributor.authorHorng Sheng-Fuen_US
dc.contributor.authorZan Hsiao-Wenen_US
dc.contributor.authorChang Hao-Wenen_US
dc.contributor.authorChang Yu-Fanen_US
dc.contributor.authorChiu Yu-Chianen_US
dc.date.accessioned2014-12-16T06:14:50Z-
dc.date.available2014-12-16T06:14:50Z-
dc.date.issued2014-02-13en_US
dc.identifier.govdocH01L051/40zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104956-
dc.description.abstractA method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR MANUFACTURING ORGANIC ELECTRONIC COMPONENT HAVING SLAT COMPOUNDzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140045298zh_TW
Appears in Collections:Patents


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