Title: High-performance GaN-based vertical-injection light-emitting diodes with TiO2-SiO2 omnidirectional reflector and n-GaN roughness
Authors: Huang, H. W.
Kuo, H. C.
Lai, C. F.
Lee, C. E.
Chiu, C. W.
Lu, T. C.
Wang, S. C.
Lin, C. H.
Leung, K. M.
光電工程學系
Department of Photonics
Keywords: flip-chip;light-emitting diode (LED);omnidirectional reflector (ODR)
Issue Date: 1-Mar-2007
Abstract: We have designed and fabricated a new type of GaN-based thin-film vertical-injection light-emitting diode (LED) with TiO2-SiO2 onmidirectional reflector (ODR) and n-GaN roughness. The associated ODR designed for LED operation wavelength at 455 nm vias integrated with patterned conducting channels for the purpose of vertical current spreading. With the help of laser lift-off and. photo-electrochemical etching technologies, at a driving current of 350 mA and with chip size of 1 mm x 1 mm, the light-output power and the external quantum efficiency of our thin-film LED with TiO2-SiO2 ODR reached 330 mW and 26.7%. The result demonstrated 18% power enhancement when compared with the results from the thin-film LED with Al reflector replace.
URI: http://dx.doi.org/10.1109/LPT.2007.893829
http://hdl.handle.net/11536/11079
ISSN: 1041-1135
DOI: 10.1109/LPT.2007.893829
Journal: IEEE PHOTONICS TECHNOLOGY LETTERS
Volume: 19
Issue: 5-8
Begin Page: 565
End Page: 567
Appears in Collections:Articles


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