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dc.contributor.authorHsiao, Sheng-Yien_US
dc.contributor.authorLee, Chih-Chunen_US
dc.contributor.authorChiu, Yien_US
dc.contributor.authorShih, Hsi-Fuen_US
dc.contributor.authorChiou, Jin-Chemen_US
dc.contributor.authorShieh, Han-Ping D.en_US
dc.contributor.authorFang, Weileunen_US
dc.date.accessioned2017-04-21T06:49:36Z-
dc.date.available2017-04-21T06:49:36Z-
dc.date.issued2008en_US
dc.identifier.isbn978-1-4244-1917-3en_US
dc.identifier.urihttp://dx.doi.org/10.1109/OMEMS.2008.4607849en_US
dc.identifier.urihttp://hdl.handle.net/11536/135060-
dc.description.abstractA MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.en_US
dc.language.isoen_USen_US
dc.subjectSmall form factoren_US
dc.subjectoptical pickup headen_US
dc.subjectcrystalline plane mirroren_US
dc.subjectwafer level packagingen_US
dc.titleWafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Headen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/OMEMS.2008.4607849en_US
dc.identifier.journal2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICSen_US
dc.citation.spage102en_US
dc.citation.epage+en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000264556700052en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper


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