台灣半導體設備商公司治理策略研究-3D IC封裝技術/IC載板設備商

完整后设资料纪录

DC 栏位	值	语言
dc.contributor.author	王彦智	zh_TW
dc.contributor.author	叶银华	zh_TW
dc.contributor.author	Wang,Yen-Chih	en_US
dc.contributor.author	Yeh,Yin-Hua	en_US
dc.date.accessioned	2018-01-24T07:39:05Z	-
dc.date.available	2018-01-24T07:39:05Z	-
dc.date.issued	2016	en_US
dc.identifier.uri	http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070363034	en_US
dc.identifier.uri	http://hdl.handle.net/11536/140290	-
dc.language.iso	zh_TW	en_US
dc.subject	半导体设备商	zh_TW
dc.subject	3D IC先进封装	zh_TW
dc.subject	资本支出	zh_TW
dc.subject	公司治理	zh_TW
dc.subject	Semiconductor Equipment Vendor	en_US
dc.subject	3D IC Advanced Package	en_US
dc.subject	Capital Expenditure	en_US
dc.subject	Corporate Goverance	en_US
dc.title	台湾半导体设备商公司治理策略研究-3D IC封装技术/IC载板设备商	zh_TW
dc.title	Corporate Governance Strategy of Taiwan Semiconductor Equipment Suppliers-3DIC Packaging technology / IC carrier equipment supplier	en_US
dc.type	Thesis	en_US
dc.contributor.department	管理学院高阶主管管理硕士学程	zh_TW
显示于类别：	Thesis