Title: | Enhancement of CMOS THz Imaging Sensing By Packaging Technology |
Authors: | Kuo, Chien-Nan Chen, Wei-Cheng Chiu, Te-Yen Li, Chun-Hsing 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
Keywords: | CMOS;THz;imaging system;3D;switch;dielectric resonator |
Issue Date: | 1-Jan-2017 |
Abstract: | Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in low cost and a small form factor. The technology advance is technically viable for circuit design in such high frequencies. Lossy silicon substrate, however, still degrades system performance. We will discuss the techniques of performance enhancement. |
URI: | http://hdl.handle.net/11536/147069 |
Journal: | 2017 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT) |
Begin Page: | 22 |
End Page: | 24 |
Appears in Collections: | Conferences Paper |