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dc.contributor.authorHorng, Ray-Huaen_US
dc.contributor.authorTseng, Ming-Chunen_US
dc.contributor.authorWuu, Dong-Singen_US
dc.date.accessioned2019-04-02T06:00:21Z-
dc.date.available2019-04-02T06:00:21Z-
dc.date.issued2019-01-01en_US
dc.identifier.issn2073-4352en_US
dc.identifier.urihttp://dx.doi.org/10.3390/cryst9010001en_US
dc.identifier.urihttp://hdl.handle.net/11536/148867-
dc.description.abstractThe properties of metal-oxide semiconductor (MOS) capacitors with different chemical treatments have been examined in this study. A MOS capacitor consists of an Al2O3/n-GaN/AlN buffer/Si substrate. Four chemical treatments, containing organic solvents, oxygen plasma and BCl3 plasma, dilute acidic and alkali solvents, and hydrofluoric acid, were used to reduce the metal ions, native oxides, and organic contaminants. The n-GaN surface was treated with these chemical treatments before Al2O3 was grown on the treated n-GaN surface to reduce the interface state trap density (D-it). The value of D-it was calculated using the capacitance-voltage curve at 1 MHz. The D-it of a u-GaN surface was modified using various solutions, which further influenced the contact properties of GaN.en_US
dc.language.isoen_USen_US
dc.subjectchemical treatmenten_US
dc.subjectcapacitoren_US
dc.subjectinterface state trap densityen_US
dc.titleSurface Treatments on the Characteristics of Metal-Oxide Semiconductor Capacitorsen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/cryst9010001en_US
dc.identifier.journalCRYSTALSen_US
dc.citation.volume9en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000458578100001en_US
dc.citation.woscount0en_US
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