Title: | 發光元件封裝結構 |
Authors: | 林建中 郭浩中 佘慶威 韓皓惟 陳國儒 凃宗逸 塗軒豪 |
Issue Date: | 16-Feb-2017 |
Abstract: | 本發明提供一種發光元件封裝結構,其包含基板、發光元件陣列、封膠層、散射粒子以及螢光材料層。發光元件陣列位於基板上。封膠層覆蓋發光二極體陣列。散射粒子散佈於封膠層中。螢光材料層位於封膠層上。 |
Gov't Doc #: | H01L033/50 H01L033/48 |
URI: | http://hdl.handle.net/11536/151325 |
Patent Country: | TWN |
Patent Number: | 201707242 |
Appears in Collections: | Patents |
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