Title: 發光元件封裝結構
Authors: 林建中
郭浩中
佘慶威
韓皓惟
陳國儒
凃宗逸
塗軒豪
Issue Date: 16-Feb-2017
Abstract: 本發明提供一種發光元件封裝結構,其包含基板、發光元件陣列、封膠層、散射粒子以及螢光材料層。發光元件陣列位於基板上。封膠層覆蓋發光二極體陣列。散射粒子散佈於封膠層中。螢光材料層位於封膠層上。
Gov't Doc #: H01L033/50
H01L033/48
URI: http://hdl.handle.net/11536/151325
Patent Country: TWN
Patent Number: 201707242
Appears in Collections:Patents


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