Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Title:	Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
Authors:	Yang, Kai-Ming Chou, Tzu-Chieh Ko, Cheng-Ta Lin, Chen-Hao Chen, Yu-Hua Tseng, Tzyy-Jang Wu, Wen-Wei Chen, Kuan-Neng 交大名義發表 National Chiao Tung University
Issue Date:	1-Jan-2019
Abstract:	In this paper, low temperature (190-220 degrees C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP).
URI:	http://hdl.handle.net/11536/153257
ISBN:	978-4-904743-07-2
Journal:	PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)
Begin Page:	10
End Page:	10
Appears in Collections:	Conferences Paper