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dc.contributor.authorLee, Ko-Huien_US
dc.contributor.authorTsai, Jung-Rueyen_US
dc.contributor.authorChang, Ruey-Daren_US
dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2014-12-08T15:32:59Z-
dc.date.available2014-12-08T15:32:59Z-
dc.date.issued2013-10-07en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4824817en_US
dc.identifier.urihttp://hdl.handle.net/11536/22986-
dc.description.abstractA gate-all-around polycrystalline silicon nanowire (NW) floating-gate (FG) memory device was fabricated and characterized in this work. The cross-section of the NW channels was intentionally made to be triangular in shape in order to study the effects of the corners on the device operation. Our results indicate that the channel corners are effective in lowering the programming and erasing (P/E) operation voltages. As compared with the charge-trapping type devices, a larger memory window is obtained with the FG scheme under low-voltage P/E conditions. A model considering the nature of the charge storage medium is proposed to explain the above findings. (C) 2013 AIP Publishing LLC.en_US
dc.language.isoen_USen_US
dc.titleLow-voltage high-speed programming/erasing floating-gate memory device with gate-all-around polycrystalline silicon nanowireen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4824817en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume103en_US
dc.citation.issue15en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000325779700063-
dc.citation.woscount0-
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