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dc.contributor.authorShye, DCen_US
dc.contributor.authorHwang, CCen_US
dc.contributor.authorLai, MJen_US
dc.contributor.authorJaing, CCen_US
dc.contributor.authorChen, JSen_US
dc.contributor.authorHuang, Sen_US
dc.contributor.authorJuang, MHen_US
dc.contributor.authorChiou, BSen_US
dc.contributor.authorCheng, HCen_US
dc.date.accessioned2014-12-08T15:41:20Z-
dc.date.available2014-12-08T15:41:20Z-
dc.date.issued2003-02-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.42.549en_US
dc.identifier.urihttp://hdl.handle.net/11536/28115-
dc.description.abstractWe investigated how oxygen plasma post-treatment improves leakage characteristics of Pt/(Ba,Sr)TiO3 (BST)/Pt capacitors prepared by the radio-frequency (RF) cosputtering technique. Experimental results indicate that oxygen plasma treatment can effectively passivate the oxygen vacancies of (Ba,Sr)TiO3 (BST) films, thus decreasing the electric conduction paths of leakage currents. By this low-temperature (250degreesC), and short-duration (similar to5 min) process, the leakage current is reduced by as many as two orders of magnitude. The reliability characteristics of time-dependent dielectric breakdown (TDDB) are improved as well. However, the usage of oxygen plasma treatment is not unrestricted. Plasma treatment for an extended period (more than 10 min) degrades both the leakage and reliability characteristics, due to plasma damage. Excellent electrical characteristics, including low leakage current (1.5 x 10(-8) A/cm(2)) under 0.1 MV/cm, high dielectric constant (288), and a lifetime longer than 10 years under 2 MV/cm can be achieved. Therefore, the proposed technique for as-deposited BST films is a highly promising means of improving the electrical characteristics of BST thin films.en_US
dc.language.isoen_USen_US
dc.subjectBST filmsen_US
dc.subjectleakage currenten_US
dc.subjectoxygen vacanciesen_US
dc.subjectoxygen plasmaen_US
dc.subjectlow temperatureen_US
dc.titleEffects of post-oxygen plasma treatment on Pt/(Ba,Sr)TiO3/Pt capacitors at low substrate temperaturesen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.42.549en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume42en_US
dc.citation.issue2Aen_US
dc.citation.spage549en_US
dc.citation.epage553en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000181805200040-
dc.citation.woscount14-
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