ENHANCEMENT OF CF4 AND O2 REACTIVE ION ETCHING RESISTANCE OF POLY(BUTENE-1 SULFONE) BY N2 PLASMA PRETREATMENT

Title:	ENHANCEMENT OF CF4 AND O2 REACTIVE ION ETCHING RESISTANCE OF POLY(BUTENE-1 SULFONE) BY N2 PLASMA PRETREATMENT
Authors:	LOONG, WA CHANG, HW 交大名義發表應用化學系 National Chiao Tung University Department of Applied Chemistry
Keywords:	PLASMAS;PHOTOLITHOGRAPHY;SEMICONDUCTOR DOPING;SEMICONDUCTOR GROWTH
Issue Date:	14-Mar-1991
Abstract:	The resistance of poly(butene-1 sulfone) (PBS) to CF4 and oxygen reactive ion etching is greatly enhanced by low power nitrogen plasma pretreatment. The original thickness of PBS can be maintained.
URI:	http://hdl.handle.net/11536/3837
ISSN:	0013-5194
Journal:	ELECTRONICS LETTERS
Volume:	27
Issue:	6
Begin Page:	541
End Page:	542
Appears in Collections:	Articles

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