| 標題: | WETTABILITY IN ZRO2-NI AND ZRO2-CU BONDING |
| 作者: | DUH, JG CHIEN, WS CHIOU, BS 電控工程研究所 Institute of Electrical and Control Engineering |
| 公開日期: | 1-Apr-1989 |
| URI: | http://hdl.handle.net/11536/4381 |
| ISSN: | 0261-8028 |
| 期刊: | JOURNAL OF MATERIALS SCIENCE LETTERS |
| Volume: | 8 |
| Issue: | 4 |
| 起始頁: | 405 |
| 結束頁: | 408 |
| 顯示於類別： | Articles |
- 硬焊合金對矽晶片和鑽石膜之潤濕性研究 / 王怡明;Wang, Yi-Ming;郭正次;Cheng-Tzu Kuo
- 利用銀銅基銲料接合氧化鋯與純鈦之強度測試與其機械性質 / 丘仲民;Chiu, Chung-Min;林健正;Lin, Chien-Cheng
- Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 degrees C / Wei, Shen-Hung;Lin, Chien-Cheng
- 氧化鋯接合金屬高溫反應機構及其微觀分析 / 魏伸紘;Wei, Shen-Hung;林健正;Lin, Chien-Cheng
- 不同組成CeO2/ZrO2複合材料與鈦金屬高溫擴散反應 / 彭翊瑋;林健正
- Wettability of electroless Ni in the under bump metallurgy with lead free solder / Young, BL;Duh, JG;Chiou, BS
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