| 標題: | 苯並環丁烯在矽基板上的黏著性研究 A study of adhesion of benzocyclobutene on silicon substrate |
| 作者: | 陳盈佳 Chen, Ying Jia 謝宗雍 Xie, Zong Yong 材料科學與工程學系 |
| 公開日期: | 1994 |
| URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT832159005 http://hdl.handle.net/11536/59669 |
| 顯示於類別： | 畢業論文 |
- 多晶片模組之基板製成與晶片接合技術的研究---子計畫III：苯并環丁烯薄膜在矽與鋁上黏著特性之研究(I) / 謝宗雍;HSIEH TSUNG-EONG
- 苯並環丁烯在鋁上的黏著性研究 / 彭文崇;Perng, Wen Chung;謝宗雍;T.E. Hsieh
- Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications / Shih, Jian-Yu;Huang, Wen-Chun;Ko, Cheng-Ta;Yang, Zheng;Hu, Sheng-Hsiang
- The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application / Yang, Chia-Yeh;Cheng, Yu-Ting;Hsu, Wen-Syang
- Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications / Wang, Chin-Te;Hsu, Li-Han;Wu, Wei-Cheng;Hsu, Heng-Tung;Chang, Edward Yi
Loading...