Title: Field Dependence of Porous Low-k Dielectric Breakdown as Revealed by the Effects of Line Edge Roughness on Failure Distributions
Authors: Lee, S. C.
Oates, A. S.
Chang, K. M.
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Keywords: Cu/low-k interconnect reliability;line edge roughness (LER);time-dependent dielectric breakdown (TDDB)
Issue Date: 1-Mar-2011
Abstract: We investigate the electric field (E) dependence of the breakdown of porous low-k dielectrics by measuring the changes in the failure time distribution resulting from the presence of line edge roughness. We show that the Weibull beta increases with decreasing field, clearly demonstrating that dielectric breakdown does not exhibit 1/E or E(-n) characteristics.
URI: http://dx.doi.org/10.1109/TDMR.2010.2103316
http://hdl.handle.net/11536/9216
ISSN: 1530-4388
DOI: 10.1109/TDMR.2010.2103316
Journal: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume: 11
Issue: 1
Begin Page: 201
End Page: 203
Appears in Collections:Articles


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