以微電鍍法製作次微米孔穴的研究

Title:	以微電鍍法製作次微米孔穴的研究 Fabrication of Sub-Micro Aperture by Micro Electroplating
Authors:	徐文祥 HSU WENSYANG 國立交通大學機械工程學系
Keywords:	微電鍍;次微米孔穴;製造;Micro electroplating;Sub-micro aperture;Fabrication
Issue Date:	2001
Gov't Doc #:	NSC90-2212-E009-033
URI:	http://hdl.handle.net/11536/93556 https://www.grb.gov.tw/search/planDetail?id=645475&docId=121268
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.