SPICE上多網目式電路板溫度模擬模式之建立

Title:	SPICE上多網目式電路板溫度模擬模式之建立 The Multi-Meshed Temperature Model of PCB in SPICE
Authors:	張隆國國立交通大學控制工程學系
Keywords:	SPICE;印刷電路板;熱傳導;熱對流;熱輻射;有限差分法;SPICE;Printed circuit board;Thermal conduction;Thermal convection;Thermalradiation;Finite difference method
Issue Date:	1996
Gov't Doc #:	NSC85-2213-E009-102
URI:	http://hdl.handle.net/11536/96091 https://www.grb.gov.tw/search/planDetail?id=225618&docId=40546
Appears in Collections:	Research Plans