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王英郎

王英郎 WANG, Ying-Lang

服務單位／Department：光電學院 ／ 照明與能源光電研究所

著作期間／Publish Period：1996 - 2014-10-05

著作統計／Statistics

Article（61）
Others（2）
Proceedings Paper（36）
Thesis（7）

Article

序號
No.		 標題
Title		 著作日期
Date
1 Effect of layout on electromigration characteristics in copper dual damascene interconnects
 2014-10-05
2 Development of a Wearable Mobile Electrocardiogram Monitoring System by Using Novel Dry Foam Electrodes
 2014-09-01
3 A temperature-induced and shear-reversible assembly of latanoprost-loaded amphiphilic chitosan colloids: Characterization and in vivo glaucoma treatment
 2014-07-01
4 Effect of polyimide baking on bump resistance in flip-chip solder joints
 2014-03-01
5 A Fully Integrated 8-Channel Closed-Loop Neural-Prosthetic CMOS SoC for Real-Time Epileptic Seizure Control
 2014-01-01
6 An electroplating method for copper plane twin boundary manufacturing
 2013-10-01
7 The influence of abrasive particle size in copper chemical mechanical planarization
 2013-09-01
8 Investigation the Electroplating Behavior of Self Formed CuMn Barrier 2013-08-01
9 A hierarchical approach for online temporal lobe seizure detection in long-term intracranial EEG recordings
 2013-08-01
10 Impact of Electroforming Current on Self-Compliance Resistive Switching in an ITO/Gd:SiOx/TiN Structure
 2013-07-01
11 Atomic-level quantized reaction of HfOx memristor
 2013-04-29
12 A comparative study of sustainability management education in China and the USA
 2013-02-01
13 Investigating bipolar resistive switching characteristics in filament type and interface type BON-based resistive switching memory
 2013-02-01
14 Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
 2013-02-01
15 Comparison of H-2 and NH3 Treatments for Copper Interconnects
 2013-01-01
16 A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing 2012-09-01
17 Optimization of magnetoelectricity in multiferroic fibrous composites
 2012-07-01
18 Oropharyngeal yeast colonization in HIV-infected outpatients in southern Taiwan: CD4 count, efavirenz therapy and intravenous drug use matter
 2012-05-01
19 Information technology innovation in India: The top 100 IT firms
 2012-05-01
20 Brand marketing for creating brand value based on a MCDM model combining DEMATEL with ANP and VIKOR methods
 2012-04-01
21 Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization
 2012-03-01
22 Asymmetric Carrier Conduction Mechanism by Tip Electric Field in WSiOX Resistance Switching Device
 2012-03-01
23 A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
 2012-03-01
24 Silicon introduced effect on resistive switching characteristics of WO(X) thin films 2012-01-09
25 Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
 2011-12-01
26 Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process 2011-11-01
27 Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN films 2011-05-31
28 Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides 2011-04-01
29 Nanostructured Nanorod Arrays Presenting TiO(2) Nanorods/Poly(3-hexylthiophene) for Solar Cells Application 2011-04-01
30 Enhanced Performance and Stability of a Polymer Solar Cell by Incorporation of Vertically Aligned, Cross-Linked Fullerene Nanorods
 2011-01-01
31 Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates 2011-01-01
32 Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
 2011-01-01
33 Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
 2010-10-01
34 Pseudospectral Modeling of Nano-Optics in Ag Sphere Arrays
 2010-10-01
35 Inverted heterojunction solar cells incorporating fullerene/polythiophene composite core/shell nanorod arrays
 2010-04-09
36 Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization 2010-01-01
37 Learning and innovation in small and medium enterprises
 2010-01-01
38 Evolution of Fluorine Content with Precipitate Formation in Fluorine-Doped Silicon Oxide
 2009-08-01
39 Ordered polythiophene/fullerene composite core-shell nanorod arrays for solar cell applications
 2009-02-18
40 CoSix thermal stability on narrow-width polysilicon resistors
 2006-01-01
41 Study of diffusion and quality control for CoSi2 formation by oxide-mediated cobalt silicidation with Ti capping
 2005-09-01
42 Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection
 2005-05-01
43 Formation of pyramid-like nanostructures during cobalt film growth by magnetron sputtering
 2005-04-01
44 Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interface
 2005-01-24
45 Stress migration and electromigration improvement for copper dual damascene interconnection
 2005-01-01
46 Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidation
 2004-09-01
47 Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application
 2004-07-01
48 Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization
 2004-01-15
49 Pattern-dependent copper microcorrosion from CMP 2004-01-01
50 Roles of copper mechanical characteristics in electropolishing
 2004-01-01
51 The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
 2003-11-15
52 Mechanisms of circular defects for shallow trench isolation oxide deposition
 2003-09-01
53 Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate films
 2003-07-01
54 Superpolishing for planarizing copper damascene interconnects 2003-05-01
55 Improving the quality of electroplated copper films by rapid thermal annealing
 2003-03-01
56 The removal selectivity of titanium and aluminum in chemical mechanical planarization
 2002-03-01
57 X-ray reflectivity and FTIR measurements of N-2 plasma effects on the density profile of hydrogen silsesquioxane thin films
 2001-10-01
58 A ULSI shallow trench isolation process through the integration of multilayered dielectric process and chemical-mechanical planarization
 1999-06-22
59 The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection
 1998-01-01
60 A modified multi-chemicals spray cleaning process for post-CMP cleaning application
 1998-01-01
61 Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement
 1997-09-01

Others

序號
No.		 標題
Title		 著作日期
Date
1 How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment
 2013-01-15
2 Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes
 1997-02-01

Proceedings Paper

序號
No.		 標題
Title		 著作日期
Date
1 An energy efficient real-time seizure detection method in rats with spontaneous temporal lobe epilepsy 2013-01-01
2 Use of accelerometers to detect motor states in a seizure of rats with temporal lobe epilepsy 2012-01-01
3 Entrepreneurial orientation, learning orientation, and innovation in small and medium enterprises
 2011-01-01
4 Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process 2010-11-01
5 Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry 2010-07-01
6 Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide
 2008-02-01
7 Copper voids improvement for the copper dual damascene interconnection process
 2008-02-01
8 Plasma treatment effects on hydrogenated amorphous carbon films prepared by plasma-enhanced chemical vapor deposition
 2008-02-01
9 Low power and reliable interconnection with self-corrected green coding scheme for network-on-chip 2007-01-01
10 Comparison of characteristics and integration of copper diffusion-barrier dielectrics
 2006-03-01
11 Novel slurry solution for dishing elimination in copper process beyond 0.1-mu m technology
 2006-03-01
12 High-selectivity damascene chemical mechanical polishing
 2006-03-01
13 Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process
 2006-03-01
14 Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power
 2006-03-01
15 Mechanism for Cu void defect on various electroplated film conditions
 2006-03-01
16 Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technology
 2006-03-01
17 Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer
 2006-03-01
18 Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region
 2006-03-01
19 Investigation of overpotential and seed thickness on damascene copper electroplating
 2006-02-24
20 Heat, moisture and chemical resistance on low dielectric constant (low-k) film using diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
 2006-02-24
21 Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane
 2006-02-24
22 Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide films
 2006-02-24
23 The study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidation
 2006-02-24
24 Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide
 2004-05-01
25 Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
 2004-01-30
26 Copper surface protection with a completely enclosed copper structure for a damascene process
 2004-01-30
27 Study on precipitations of fluorine-doped silicon oxide
 2004-01-30
28 Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material
 2004-01-30
29 Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
 2004-01-30
30 Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
 2001-11-01
31 Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process
 2001-11-01
32 Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologies
 2001-01-01
33 Study the impact of liner thickness on the 0.18 mu m devices using low dielectric constant hydrogen silsesquioxane as the interlayer dielectric
 2000-12-01
34 A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application
 1998-11-02
35 Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology
 1997-10-31
36 Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity
 1997-10-31

Thesis

序號
No.		 標題
Title		 著作日期
Date
1 可注射式雙性幾丁聚醣奈米凝膠用於青光眼藥物緩釋型治療之開發與研究 2012
2 淺溝槽隔離平坦化技術在奈米半導體積體電路製造製程研究 2011
3 半導體廠深紫外光(248奈米波長)雷射曝光機, A/B鏡頭及雷射共振腔壽命延長藉由高效率的功率曲線控制之研究
 2011
4 壓電壓磁纖維複合材料磁電耦合效應之最佳化
 2010
5 多重假設檢定問題下t統計量的行為
 2008
6 基於UCT之九路電腦圍棋程式HappyGO的設計與實作
 2008
7 化學機械研磨在深次微米半導體元件製造之應用 1996
光電學院