Statistics

Total Visits

Views
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results 116

Total Visits per Month

六月 2025 七月 2025 八月 2025 九月 2025 十月 2025 十一月 2025 十二月 2025
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results 0 0 0 2 0 3 0

File Downloads

Views
000240072400008.pdf 6

Top Country Views

Views
中國 97
美國 14
法國 2
波蘭 1

Top City Views

Views
Shenzhen 94
Menlo Park 7
Kensington 4
Beijing 3
Gif-sur-yvette 2
Buffalo 1
Edmond 1
Los Angeles 1
Wroclaw 1