| Title: | 以共價鍵結合之聚亞醯胺/無機奈米複合材料(I) Convalent-Bonded Polyimide/Inorganics Nanocomposites(I) |
| Authors: | 韋光華 KUNG-HWAWEI 交通大學材料科學與工程系 |
| Issue Date: | 2001 |
| Gov't Doc #: | NSC90-2216-E009-017 |
| URI: | http://hdl.handle.net/11536/93399 https://www.grb.gov.tw/search/planDetail?id=712235&docId=133568 |
| Appears in Collections: | Research Plans |
- Convalently bonded polyhedral oligomeric silsesquioxane/polyimide nanocomposites and process for synthesizing the same / Wei, Kung-Hwa;Leu, Chyi-Ming
- 光電用含氟聚亞醯胺/無機奈米複合材料(II) / 韋光華;KUNG-HWAWEI
- 光電用含氟聚亞醯胺/無機奈米複合材料 / 韋光華;KUNG-HWAWEI
- 共軛高分子/二維奈米無機複合材料之形態與光電性質研究 / 韋光華;WEI KUNG-HWA
- Characterizing mechanical properties of particulate nanocomposites using micromechanical approach / Tsai, Jia-Lin;Tzeng, Shi-Hua
- Polyimide and polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric applications / Lee, YJ;Huang, JM;Kuo, SW;Lu, JS;Chang, FC
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