| 標題: | 覆加銅層之厚膜銀基導體研究 Cu-Modified Thick Film Ag-Based Conductor |
| 作者: | 邱碧秀 CHIOU BI-SHIOU 國立交通大學電子工程研究所 |
| 公開日期: | 1995 |
| 官方說明文件#: | NSC84-2215-E009-053 |
| URI: | http://hdl.handle.net/11536/96692 https://www.grb.gov.tw/search/planDetail?id=169492&docId=28445 |
| Appears in Collections: | Research Plans |
- TEMPERATURE CYCLING EFFECTS BETWEEN SN/PB SOLDER AND THICK-FILM PD/AG CONDUCTOR METALLIZATION / CHIOU, BS;LIU, KC;DUH, JG;PALANISAMY, PS
- INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES / CHIOU, BS;LIU, KC;DUH, JG;PALANISAMY, PS
- The CVD growth of Cu films using H-2 as carrier gas / Lin, PJ;Chen, MC
- Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 degrees C / Wei, Shen-Hung;Lin, Chien-Cheng
- Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package / Huang, CS;Duh, JG;Chen, YM
Loading...